13 Nov 2017 Denver - CoolIT Systems, a global expert in energy efficient liquid cooling solutions for HPC, Cloud and Hyperscale markets, returns to the highly-anticipated Supercomputing Conference 2017 (SC17) in Denver, Colorado for the sixth consecutive year with its latest Rack DCLC and Closed-Loop DCLC innovations for data centres and servers.
As the most popular integration partner for OEM server manufacturers, CoolIT will showcase liquid-enabled servers from Intel, Dell EMC, HPE, and Huawei. Combined with the broadest range of heat exchangers and supporting liquid infrastructure, CoolIT and their OEM partners are delivering the most complete and robust liquid cooling solutions to the HPC market.
CoolIT OEM solutions being shown at booth 1601 include:
Debuting at SC17 are two industry-first Heat Exchange Modules:
CoolIT will also showcase its Liquid-to-Liquid heat exchangers, including the stand-alone Rack DCLC CHx650, and the 4u Rack DCLC CHx80 that provides 80-100kW cooling capacity with N+1 reliability to manage the most challenging, high density HPC racks.
For the first time, CoolIT will showcase its advanced Rack DCLC Command2 Control System for Heat Exchange Modules. Attendees can experience the plug-and-play functionality of Command2, including built-in autonomous controls and sophisticated safety features.
The latest CPU and GPU coldplate assemblies to support CoolIT's passive Rack DCLC platform will be displayed, including the RX1 for Intel Xeon Scalable Processor Family (Skylake), the GP1 for NVIDIA Tesla P100 and GP2 for NVIDIA Tesla V100. Additionally, CoolIT's full coverage MX1, MX2 and MX3 memory cooling coldplates will be featured.
CoolIT will highlight customer installations including:
In partnership with STULZ, CoolIT will host an SC17 Exhibitor Forum presentation on high-density Chip-to-Atmosphere data center cooling solutions on November 16 at 11.00am. CoolIT encourages all attendees to join the Chip-to-Atmosphere: Providing Safe and Effective Cooling for High-Density, High-Performance Data Center Environments presentation in room 503-504. During the session, David Meadows, Director of Industry, Standards and Technology at STULZ Air Technology Systems Inc. and Geoff Lyon, CEO and CTO at CoolIT Systems, will be discussing the efficiency gains and performance enhancements made possible by liquid cooling solutions.
"Liquid cooling in the data center continues to grow in adoption and delivers more compelling ROIs. Our collaboration with OEM partners such as Dell EMC, HPE, Intel and STULZ provides further evidence that the future of the data centre is destined for liquid cooling", stated Geoff Lyon, CEO and CTO at CoolIT Systems.
To learn more about how CoolIT's products and solutions maximize data centre performance and efficiency, you can visit booth 1601 at SC17. Executives and technical staff will be on site to guide attendees through new product showcases and live demos.