10 Nov 2017 Calgary - CoolIT Systems, a global expert in energy efficient liquid cooling solutions for HPC, Cloud, and Enterprise markets, has expanded its Rack DCLC product line with the release of the AHx2 Heat Exchange Module. This compact Liquid-to-Air heat exchanger makes it possible for Direct Contact Liquid Cooling (DCLC) enabled servers to be thermally tested during the factory burn-in process, without additional liquid cooling infrastructure. CoolIT will officially launch the AHx2 at the Supercomputing Conference 2017 (SC17) in Denver, Colorado.
The AHx2 is a vital addition to CoolIT's broad range of liquid cooling products. It is a compact, easy to transport air heat exchanger designed to enable factory server burn-in when liquid is not present in the facility. As a Liquid-to-Air heat exchanger, the AHx2 dissipates heat from the coolant in the server loop to the ambient environment. AHx2 provides direct liquid cooling to four DCLC enabled servers, and provides 2kW of heat load management. The design and size allows the unit to safely sit on top or adjacent to a server chassis during manufacturing.
"The Rack DCLC AHx2 Module is the ideal way for OEMs and System Integrators to conduct thermal testing during the factory burn-in process", stated Patrick McGinn, VP of Product Marketing, CoolIT Systems. "Our customers will appreciate having access to such robust testing potential in such a compact design, without needing to invest in supplementary liquid cooling infrastructure."
The AHx2 Heat Exchange Module is a product designed to meet a critical customer need, and as such, is an important part of CoolIT's modular product array. SC17 attendees can learn more about the solution by visiting CoolIT at booth 1601 from November 13-16.