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Primeur weekly 2020-10-12

Focus

Future of European HPC and TOP500 in the picture at Russian Supercomputing Days ...

Two European approaches for modelling and mapping the COVID-19 pandemic ...

European-Brazilian consortium joins forces in advanced HPC wind turbine simulations for use in on- and offshore wind energy farms ...

Exascale supercomputing

PerMedCoE: Exascale-ready cell-level simulations for European Personalised Medicine ...

Quantum computing

New algorithm could unleash the power of quantum computers ...

Light Rider unveils quantum LiFi technology to create next-generation network security ...

Research and Markets to issue report on Quantum Networking: A Ten-year Forecast and Opportunity Analysis ...

Focus on Europe

Linköping University chooses Atos to build Sweden's largest supercomputer for AI ...

Atos inaugurates BullSequana XH2000 at CSC - the fastest supercomputer in the Nordics ...

Making supercomputers carbon neutral - CSC's data centre will be powered with hydro-electricity supplied by Vattenfall ...

Middleware

Verne Global achieves Dell Technologies Platinum Partner status ...

Altair acquires M-Base Engineering + Software GmbH, leader in plastics material data and technology ...

Hardware

CoolIT Systems launches rack DLC CHx200 CDU ...

NVIDIA introduces new family of BlueField DPUs to bring breakthrough networking, storage and security performance to every data centre ...

CoolIT prevails against Asetek, PTAB determines no challenged claims unpatentable ...

CMKL University implementing DDN and NVIDIA solution for AI-centric supercomputing and research ...

OpenFive and AnalogX to provide optimized Chip-to-Chip interface IP solutions ...

Defense and intelligence executive Melvin Cordova joined Tachyum Government Corp. ...

TrendForce announces tech industry trends for 2021 ...

Cerebras Systems appoints Tony Maslowski as Chief Financial Officer ...

DoD deploys three Liqid composable supercomputing facilities powered by NVIDIA A100 GPU computing and NVIDIA Mellanox HDR 200Gb/s InfiniBand smart networking ...

Panasas ActiveStor data storage supports materials research for dozens of scientists conducting intensive 4D modelling studies at MINES ParisTech University ...

Pavilion expands a US federal deployment, bringing the multi-year relationship to an eight-figure investment, to safeguard American lives ...

C-DAC to commission India's fastest HPC-AI supercomputer PARAM Siddhi - AI with NVIDIA ...

NVIDIA announces partnership with GSK's AI-powered Lab for Discovery of Medicines and Vaccines ...

NVIDIA announces ready-made NVIDIA DGX SuperPODs, offered by global network of certified partners ...

Supermicro expands its portfolio bringing highest density 4U server with NVIDIA HGX A100s 8-GPU and 8U SuperBlade supporting 20 A100 PCI-E GPUs ...

Supermicro to support NVIDIA Bluefield-2 DPU on industry's broadest portfolio of servers optimized for accelerated computational workloads in AI, AR/DR, and data analytics ...

Applications

NVIDIA building large computing system, dedicated to AI research in health care ...

An electrical trigger fires single, identical photons ...

Could megatesla magnetic fields be realized on Earth? ...

Top computer scientists and statisticians launch Foundations of Data Science conference ...

Comet supercomputer calculations boost understanding of immune system ...

Corona supercomputer gets funding for COVID-19 work ...

Steady progress in the battle against COVID-19 at Brookhaven National Laboratory ...

Texascale Days at TACC: Eight research teams test their codes at the largest scale on Frontera ...

Supercomputing helps advance predictive science, exascale computing ...

The Cloud

Inspur unveils Cloud SmartNIC solution based on NVIDIA DPU at GTC 2020 ...

TrendForce announces tech industry trends for 2021


6 Oct 2020 Taipei - TrendForce has presented its forecast of key trends in the tech industry for 2021.

As the DRAM industry officially enters the EUV era, NAND Flash stacking technology advances past 150L

The three major DRAM suppliers Samsung, SK Hynix, and Micron will not only continue their transition towards the 1Znm and 1alpha nm process technologies, but also formally introduce the EUV era, with Samsung leading the charge, in 2021. DRAM suppliers will gradually replace their existing double patterning technologies in order to optimize their cost structure and manufacturing efficiency.

After NAND Flash suppliers managed to push memory stacking technology past 100 layers in 2020, they will be aiming for 150 layers and above in 2021 and improving single-die capacity from 256/512Gb to 512Gb/1Tb. Consumers will be able to adopt higher-density NAND Flash products through the suppliers' efforts to optimize chip costs. While PCIe Gen 3 is currently the dominant bus interface for SSDs, PCIe Gen 4 will start gaining increased market share in 2021 owing to its integration in PS5, Xbox Series X/S, and motherboards featuring Intel's new micro-architecture. The new interface is indispensable for fulfilling the massive data transfer demand from high-end PCs, servers, and HPC data centres.

Advanced packaging will go full steam ahead in HPC and AiP

The development of advanced packaging technology has not slowed down this year despite the impact of the COVID-19 pandemic. As various manufacturers release HPC chips and antenna in package (AiP) modules, semiconductor companies such as TSMC, Intel, ASE, and Amkor are eager to participate in the burgeoning advanced packaging industry as well. With regards to HPC chip packaging, due to these chips' increased demand on I/O lead density, the demand on interposers, which are used in chip packaging, has increased correspondingly as well. TSMC and Intel have each released their new chip packaging architectures, branded 3D fabric and Hybrid Bonding, respectively, while gradually evolving their third-generation packaging technologies (CoWoS for TSMC and EMIB for Intel), to fourth-generation CoWoS and Co-EMIB technologies.

In 2021, the two foundries will be looking to benefit from high-end 2.5D and 3D chip packaging demand. With regards to AiP module packaging, after Qualcomm released its first QTM products in 2018, MediaTek and Apple subsequently collaborated with related OSAT companies, including ASE and Amkor. Through these collaborations, MediaTek and Apple hoped to make headways in the R&D of mainstream flip chip packaging, which is a relatively low-cost technology. AiP is expected to see gradual integration in 5G mmWave devices starting in 2021. Driven by 5G communications and network connectivity demand, AiP modules are expected to first reach the smartphone market and subsequently the automotive and tablet markets.

Chipmakers will pursue shares in the AIoT market through an accelerated expansionary strategy

With the rapid development of IoT, 5G, AI, and Cloud/edge computing, chipmakers' strategies have evolved from singular products, to product lineups, and finally to product solutions, thereby creating a comprehensive and granular chip ecosystem. Looking at the development of major chipmakers in recent years from a broad perspective, the continuous vertical integration of these companies have resulted in an oligopolistic industry, in which localized competition is more intense than ever. Furthermore, as 5G commercialization generates diverse application demands for various use cases, chipmakers are now offering full service vertical solutions, ranging from chip design to software/hardware platform integration, in response to the vast commercial opportunities brought about by the rapid development of the AIoT industry. On the other hand, chipmakers who were unable to position themselves in time according to market needs will likely find themselves exposed to the risk of overreliance on a single market.

Source: TrendForce

Back to Table of contents

Primeur weekly 2020-10-12

Focus

Future of European HPC and TOP500 in the picture at Russian Supercomputing Days ...

Two European approaches for modelling and mapping the COVID-19 pandemic ...

European-Brazilian consortium joins forces in advanced HPC wind turbine simulations for use in on- and offshore wind energy farms ...

Exascale supercomputing

PerMedCoE: Exascale-ready cell-level simulations for European Personalised Medicine ...

Quantum computing

New algorithm could unleash the power of quantum computers ...

Light Rider unveils quantum LiFi technology to create next-generation network security ...

Research and Markets to issue report on Quantum Networking: A Ten-year Forecast and Opportunity Analysis ...

Focus on Europe

Linköping University chooses Atos to build Sweden's largest supercomputer for AI ...

Atos inaugurates BullSequana XH2000 at CSC - the fastest supercomputer in the Nordics ...

Making supercomputers carbon neutral - CSC's data centre will be powered with hydro-electricity supplied by Vattenfall ...

Middleware

Verne Global achieves Dell Technologies Platinum Partner status ...

Altair acquires M-Base Engineering + Software GmbH, leader in plastics material data and technology ...

Hardware

CoolIT Systems launches rack DLC CHx200 CDU ...

NVIDIA introduces new family of BlueField DPUs to bring breakthrough networking, storage and security performance to every data centre ...

CoolIT prevails against Asetek, PTAB determines no challenged claims unpatentable ...

CMKL University implementing DDN and NVIDIA solution for AI-centric supercomputing and research ...

OpenFive and AnalogX to provide optimized Chip-to-Chip interface IP solutions ...

Defense and intelligence executive Melvin Cordova joined Tachyum Government Corp. ...

TrendForce announces tech industry trends for 2021 ...

Cerebras Systems appoints Tony Maslowski as Chief Financial Officer ...

DoD deploys three Liqid composable supercomputing facilities powered by NVIDIA A100 GPU computing and NVIDIA Mellanox HDR 200Gb/s InfiniBand smart networking ...

Panasas ActiveStor data storage supports materials research for dozens of scientists conducting intensive 4D modelling studies at MINES ParisTech University ...

Pavilion expands a US federal deployment, bringing the multi-year relationship to an eight-figure investment, to safeguard American lives ...

C-DAC to commission India's fastest HPC-AI supercomputer PARAM Siddhi - AI with NVIDIA ...

NVIDIA announces partnership with GSK's AI-powered Lab for Discovery of Medicines and Vaccines ...

NVIDIA announces ready-made NVIDIA DGX SuperPODs, offered by global network of certified partners ...

Supermicro expands its portfolio bringing highest density 4U server with NVIDIA HGX A100s 8-GPU and 8U SuperBlade supporting 20 A100 PCI-E GPUs ...

Supermicro to support NVIDIA Bluefield-2 DPU on industry's broadest portfolio of servers optimized for accelerated computational workloads in AI, AR/DR, and data analytics ...

Applications

NVIDIA building large computing system, dedicated to AI research in health care ...

An electrical trigger fires single, identical photons ...

Could megatesla magnetic fields be realized on Earth? ...

Top computer scientists and statisticians launch Foundations of Data Science conference ...

Comet supercomputer calculations boost understanding of immune system ...

Corona supercomputer gets funding for COVID-19 work ...

Steady progress in the battle against COVID-19 at Brookhaven National Laboratory ...

Texascale Days at TACC: Eight research teams test their codes at the largest scale on Frontera ...

Supercomputing helps advance predictive science, exascale computing ...

The Cloud

Inspur unveils Cloud SmartNIC solution based on NVIDIA DPU at GTC 2020 ...