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Primeur weekly 2016-09-26

Focus

OpenPOWER and IBM at the verge of the era of cognitive computing ...

Exascale supercomputing

Supercomputers receive funding to help predict and modify new materials ...

Focus on Europe

Calling on experts to propose tutorials and workshops for ISC 2017 ...

Adept project concludes with open-source release of energy measurement tools ...

Specific Grant Agreement One signed by the European Commission and the Human Brain Project ...

University of Amsterdam coordinates cognition research in Human Brain Project ...

New EU publication on Science, research and innovation performance of the European Union ...

Middleware

Quantum names Molly Rector Vice President of Marketing ...

IBM Research and MIT collaborate to advance frontiers of artificial intelligence in real-world audio-visual comprehension technologies ...

Hardware

UC San Diego Extension and San Diego Supercomputer Center launch Modern Data Science Academy ...

TSMC and Synopsys collaboration delivers innovative technologies for the High Performance Compute (HPC) Platform ...

Cadence and TSMC advance 7nm FinFET designs for mobile and HPC platforms ...

Volkswagen innovates manufacturing with move to Verne Global ...

Kinetica unveils GPU-accelerated database for analyzing streaming data with enhanced performance, visualization and high availability ...

CORNAMI announces $3 million funding led by Impact Venture Capital ...

Mellanox Technologies appoints Alinka Flaminia as Senior Vice President and General Counsel ...

DataCore and Supermicro offer ultra-high performance enterprise class Hyper-converged solutions ...

TYAN HPC platforms add support for NVIDIA Tesla P100, P40 and P4 GPUs ...

CENATE adds powerful testbed from NVIDIA ...

Reconfigurable chaos-based microchips offer possible solution to Moore's law ...

New Hikari supercomputer starts solar HVDC ...

India's North East region's fastest supercomputer launched by honourable Union Minister for HRD at IIT Guwahati ...

DDN leverages Lustre leadership to deliver new scalability and management capabilities and open source contributions ...

Applications

Termination of lethal arrhythmia with light ...

Artificial intelligence reveals mechanism behind brain tumour ...

Tracking down the origin of mercury contamination in human hair ...

Next generation of statistical tools to be developed for the Big Data age ...

British Artificial Intelligence firm first in Europe to use advanced deep learning supercomputer ...

Denver International Airport selects Panasonic Weather Solutions for ground operations weather forecasting ...

Ansys and TSMC empower chip manufacturers to design cutting-edge multi-die chip-package systems ...

New study shows nickel graphene can be tuned for optimal fracture strength ...

Meet Rutgers' RADICAL supercomputing guru ...

NASA Career Award winner uses Blue Waters supercomputer to mine crop yield data ...

Southeast students and faculty optimize knowledge at Supercomputing Symposium ...

The Cloud

Oracle unveils its next generation Cloud strategy: Intelligent Applications ...

Oracle announces the industry's most comprehensive offering for analytics in the Cloud ...

IBM Power Systems and Red Hat extend collaboration for next-generation Cloud platforms ...

Trifacta v4 extends enterprise data wrangling to any user, any data, any Cloud ...

Salesforce introduces Salesforce Einstein - artificial intelligence for everyone ...

Ansys and TSMC empower chip manufacturers to design cutting-edge multi-die chip-package systems

22 Sep 2016 Pittsburgh - As the number of smart, connected electronic devices grow, manufacturers of mobile, networking, automotive, industrial automation and healthcare applications need to design high performing and reliable products at a lower cost. To meet these growing demands, TSMC and Ansys are collaborating to enhance and deliver the most comprehensive suite of design solutions for TSMC's wafer-scale Integrated InFO packaging technology.

By working together, TSMC and Ansys have enabled Ansys solutions for a variety of multi-die analyses including extraction, power and reliability, signal and power integrity and thermal and electromagnetic interference. The design enablement allows mobile and IoT manufacturers to create cost-effective, thinner and highly reliable cutting-edge mobile and IoT products using Ansys' fully validated integrated circuit and package-level solutions.

"Our collaboration with TSMC has enabled the delivery of comprehensive and validated power signal integrity and reliability solutions for InFO package technology within the market", stated John Lee, general manager, Ansys. "Ansys' best in class engineering simulation solutions enable our mutual customers to innovate beyond chip to package and system-level designs for mobile and IoT applications."

"Through the intensive collaboration of both parties, we are able to address design considerations in reliability and power integrity for InFO technology", stated Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. "The enablement of ANSYS solutions ensures their readiness, allowing customers to analyze and design reliable power delivery networks across chip, package and system."
Source: Ansys

Back to Table of contents

Primeur weekly 2016-09-26

Focus

OpenPOWER and IBM at the verge of the era of cognitive computing ...

Exascale supercomputing

Supercomputers receive funding to help predict and modify new materials ...

Focus on Europe

Calling on experts to propose tutorials and workshops for ISC 2017 ...

Adept project concludes with open-source release of energy measurement tools ...

Specific Grant Agreement One signed by the European Commission and the Human Brain Project ...

University of Amsterdam coordinates cognition research in Human Brain Project ...

New EU publication on Science, research and innovation performance of the European Union ...

Middleware

Quantum names Molly Rector Vice President of Marketing ...

IBM Research and MIT collaborate to advance frontiers of artificial intelligence in real-world audio-visual comprehension technologies ...

Hardware

UC San Diego Extension and San Diego Supercomputer Center launch Modern Data Science Academy ...

TSMC and Synopsys collaboration delivers innovative technologies for the High Performance Compute (HPC) Platform ...

Cadence and TSMC advance 7nm FinFET designs for mobile and HPC platforms ...

Volkswagen innovates manufacturing with move to Verne Global ...

Kinetica unveils GPU-accelerated database for analyzing streaming data with enhanced performance, visualization and high availability ...

CORNAMI announces $3 million funding led by Impact Venture Capital ...

Mellanox Technologies appoints Alinka Flaminia as Senior Vice President and General Counsel ...

DataCore and Supermicro offer ultra-high performance enterprise class Hyper-converged solutions ...

TYAN HPC platforms add support for NVIDIA Tesla P100, P40 and P4 GPUs ...

CENATE adds powerful testbed from NVIDIA ...

Reconfigurable chaos-based microchips offer possible solution to Moore's law ...

New Hikari supercomputer starts solar HVDC ...

India's North East region's fastest supercomputer launched by honourable Union Minister for HRD at IIT Guwahati ...

DDN leverages Lustre leadership to deliver new scalability and management capabilities and open source contributions ...

Applications

Termination of lethal arrhythmia with light ...

Artificial intelligence reveals mechanism behind brain tumour ...

Tracking down the origin of mercury contamination in human hair ...

Next generation of statistical tools to be developed for the Big Data age ...

British Artificial Intelligence firm first in Europe to use advanced deep learning supercomputer ...

Denver International Airport selects Panasonic Weather Solutions for ground operations weather forecasting ...

Ansys and TSMC empower chip manufacturers to design cutting-edge multi-die chip-package systems ...

New study shows nickel graphene can be tuned for optimal fracture strength ...

Meet Rutgers' RADICAL supercomputing guru ...

NASA Career Award winner uses Blue Waters supercomputer to mine crop yield data ...

Southeast students and faculty optimize knowledge at Supercomputing Symposium ...

The Cloud

Oracle unveils its next generation Cloud strategy: Intelligent Applications ...

Oracle announces the industry's most comprehensive offering for analytics in the Cloud ...

IBM Power Systems and Red Hat extend collaboration for next-generation Cloud platforms ...

Trifacta v4 extends enterprise data wrangling to any user, any data, any Cloud ...

Salesforce introduces Salesforce Einstein - artificial intelligence for everyone ...