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Primeur weekly 2011-09-12

Exascale supercomputing

Stevens researchers pioneer novel technique to make plasmonic nanogap arrays

Desktop Grids

World Community Grid targets Leishmaniasis

The Cloud

Contrail introduces new PaaS service

IBM to power "smarter citizens" Cloud in China with System z

Chinese Government and Businesses continue to embrace IBM smarter computing

IBM broadens efforts to prepare small and medium businesses for growth

Platform Computing named best of VMworld finalist in "Private Cloud Computing" category

UC4 announces collaboration with Red Hat to enhance automated open source solutions for virtual and Cloud infrastructure

Aneka Platform for Grid and Cloud Computing finalist for Telstra Innovation Challenge

EuroFlash

AMD FirePro Professional Graphics certified for New OpenCL compliant 3D modelling application

CWI Database Architecture Group wins VLDB 2011 C&V best paper award

Mellanox provides high speed connectivity for UK-based Grid computing project

NVIDIA enables dramatic new video processing and I/O capability for Quadro and Tesla GPUs

USFlash

AMD ships first "Bulldozer" processors

Top scientists head for Australia to talk SKA

C-DAC announces first-of-its-kind industry relevant Global Certification Programme for HPC professionals

Magnetic fields keep Milky Way's central black hole hungry - for now

"Culturomics 2.0" forecasts human behaviour by supercomputing global news

Emerson Network Power launches first fanless embedded computer featuring second generation Intel processor

UC San Diego invention saving consumers trillions of watt hours and millions of dollars

3M and IBM to develop new types of adhesives to create 3D semiconductors

Strong growth continues in the worldwide disk storage systems market in the second quarter, according to IDC

Ongoing infrastructure investments carry storage software revenues to seventh consecutive quarter of growth in 2011, according to IDC

Special report highlights 'greatest hits' of scientific supercomputing

Oracle delivers Oracle Application Testing Suite 9.3, simplifies testing for Oracle's Siebel CRM

3M and IBM to develop new types of adhesives to create 3D semiconductors

7 Sep 2011 St. Paul - 3M and IBM plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers". The companies are aiming to create a new class of materials, which will make it possible to build, for the first time, commercial microprocessors composed of layers of up to 100 separate chips.

Such stacking would allow for dramatically higher levels of integration for information technology and consumer electronics applications. Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.

The companies' work can potentially leapfrog today's current attempts at stacking chips vertically - known as 3D packaging. The joint research tackles some of the thorniest technical issues underlying the industry's move to true 3D chip forms. For example, new types of adhesives are needed that can efficiently conduct heat through a densely packed stack of chips and away from heat-sensitive components such as logic circuits.

"Today's chips, including those containing '3D' transistors, are in fact 2D chips that are still very flat structures", stated Bernard Meyerson, VP of Research, IBM. "Our scientists are aiming to develop materials that will allow us to package tremendous amounts of computing power into a new form factor - a silicon 'skyscraper'. We believe we can advance the state-of-art in packaging, and create a new class of semiconductors that offer more speed and capabilities while they keep power usage low - key requirements for many manufacturers, especially for makers of tablets and smartphones."

Many types of semiconductors, including those for servers and games, today require packaging and bonding techniques that can only be applied to individual chips. 3M and IBM plan to develop adhesives that can be applied to silicon wafers, coating hundreds or even thousands of chips at a single time. Current processes are akin to frosting a cake slice-by-slice.

Under the agreement, IBM will draw on its expertise in creating unique semiconductor packaging processes, and 3M will provide its expertise in developing and manufacturing adhesive materials.

"Capitalizing on our joint know-how and industry experience, 3M looks forward to working alongside IBM - a leader in developing pioneering packaging for next-generation semiconductors", stated Herve Gindre, division vice president at 3M Electronics Markets Materials Division. "3M has worked with IBM for many years and this brings our relationship to a new level. We are very excited to be an integral part of the movement to build such revolutionary 3D packaging."

Adhesives are one of 3M's 46 core technology platforms. 3M adhesives are precisely engineered to fit customers' needs and are ubiquitous - used in a multitude of diverse products and industries including high-tech applications, such as the semiconductor industry, consumer electronic devices, aerospace and solar applications.

Source: IBM

Back to Table of contents

Primeur weekly 2011-09-12

Exascale supercomputing

Stevens researchers pioneer novel technique to make plasmonic nanogap arrays

Desktop Grids

World Community Grid targets Leishmaniasis

The Cloud

Contrail introduces new PaaS service

IBM to power "smarter citizens" Cloud in China with System z

Chinese Government and Businesses continue to embrace IBM smarter computing

IBM broadens efforts to prepare small and medium businesses for growth

Platform Computing named best of VMworld finalist in "Private Cloud Computing" category

UC4 announces collaboration with Red Hat to enhance automated open source solutions for virtual and Cloud infrastructure

Aneka Platform for Grid and Cloud Computing finalist for Telstra Innovation Challenge

EuroFlash

AMD FirePro Professional Graphics certified for New OpenCL compliant 3D modelling application

CWI Database Architecture Group wins VLDB 2011 C&V best paper award

Mellanox provides high speed connectivity for UK-based Grid computing project

NVIDIA enables dramatic new video processing and I/O capability for Quadro and Tesla GPUs

USFlash

AMD ships first "Bulldozer" processors

Top scientists head for Australia to talk SKA

C-DAC announces first-of-its-kind industry relevant Global Certification Programme for HPC professionals

Magnetic fields keep Milky Way's central black hole hungry - for now

"Culturomics 2.0" forecasts human behaviour by supercomputing global news

Emerson Network Power launches first fanless embedded computer featuring second generation Intel processor

UC San Diego invention saving consumers trillions of watt hours and millions of dollars

3M and IBM to develop new types of adhesives to create 3D semiconductors

Strong growth continues in the worldwide disk storage systems market in the second quarter, according to IDC

Ongoing infrastructure investments carry storage software revenues to seventh consecutive quarter of growth in 2011, according to IDC

Special report highlights 'greatest hits' of scientific supercomputing

Oracle delivers Oracle Application Testing Suite 9.3, simplifies testing for Oracle's Siebel CRM