Back to Table of contents

Primeur weekly 2019-07-15

Quantum computing

Quantum chemistry on quantum computers ...

Quantum computing: Forschungszentrum Jülich and Google announce research partnership ...

The best of both worlds: how to solve real problems on modern quantum computers ...

Rigetti Computing acquires QxBranch to expand full-stack capabilities ...

Focus on Europe

Pioneer satellites launched ...

Inauguration of the Minho Advanced Computing Centre - MACC - in Portugal ...

e-InfraCentral reports on successful EOSC community event in Tallinn ...

ISC High Performance announces David Keyes as 2020 Programme Chair ...

GCS Centres converge on Frankfurt for ISC19 ...

Gauss Centre for Supercomputing to open 22nd call for large-scale projects ...

Middleware

Argonne team breaks record for Globus Data Movement ...

Hardware

Verne Global joins NVIDIA DGX-Ready Data Center Programme as HPC & AI colocation partner ...

NSF funds Bridges-2 supercomputer at Pittsburgh Supercomputing Center ...

Mellanox Capital extends storage ecosystem with investments in CNEX Labs and Pliops ...

Ohio Supercomputer Center staff leading programmes at PEARC19 conference ...

Tachyum closes $25 million Series A round ...

Vantage Data Centers joins NVIDIA DGX-Ready Data Center Colocation Programme ...

World-class research centre opens in Palo Alto ...

Intel's Pohoiki Beach, a 64-chip neuromorphic system, delivers breakthrough results in research tests ...

Applications

SDSC's Comet supercomputer used to model graphene-water interaction ...

US Naval Research Laboratory 'connects the dots' for quantum networks ...

Deep learning-powered 'DeepEC' helps accurately understand enzyme functions ...

Targeting new treatments for concussions by transforming brain pathology ...

NERSC's Cori system reveals integral role of gluons in proton pressure distribution ...

CMU scientists use XSEDE-allocated resources to simulate improved battery components ...

AI Excellence in Europe: 50 million euro to bring world-class researchers together ...

The Cloud

IBM closes landmark acquisition of Red Hat for $34 billion and defines open, hybrid Cloud future ...

USFlash

Intel unveils new tools in its advanced chip packaging toolbox ...

Intel unveils new tools in its advanced chip packaging toolbox


-
9 Jul 2019 Santa Clara - At SEMICON West in San Francisco, Intel engineering leaders provided an update on Intel's advanced packaging capabilities and unveiled new building blocks, including innovative uses of EMIB and Foveros together and a new Omni-Directional Interconnect (ODI) technology. When combined with Intel's world-class process technologies, new packaging capabilities will unlock customer innovations and deliver the computing systems of tomorrow.
-

"Our vision is to develop leadership technology to connect chips and chiplets in a package to match the functionality of a monolithic system-on-chip. A heterogeneous approach gives our chip architects unprecedented flexibility to mix and match IP blocks and process technologies with various memory and I/O elements in new device form factors. Intel's vertically integrated structure provides an advantage in the era of heterogeneous integration, giving us an unmatched ability to co-optimize architecture, process and packaging to deliver leadership products", stated Babak Sabi, Intel corporate vice president, Assembly and Test Technology Development.

Chip packaging has always played a critical - if under-recognized - role in the electronics supply chain. As the physical interface between the processor and the motherboard, the package provides a landing zone for a chip's electrical signals and power supply. As the electronics industry transitions to the data-centric era, advanced packaging will play a much larger role than it has in the past.

More than just the final step in the manufacturing process, packaging is becoming a catalyst for product innovation. Advanced packaging techniques allow integration of diverse computing engines across multiple process technologies with performance parameters similar to a single die, but with a platform scope that far exceeds the die-size limit of single-die integration. These technologies will improve product-level performance, power and area while enabling a complete rethinking of system architecture.

Intel is an expert in advanced packaging technology, with current offerings spanning both 2D and 3D approaches. At SEMICON West, Intel unveiled three new technologies that will open a new dimension in product architecture:

  • Co-EMIB: Intel's EMIB and Foveros technologies leverage high-density interconnects to enable high bandwidth at low power, with I/O density on par with or better than competitive approaches. The company's new Co-EMIB technology enables the linkage of even more computing performance and capability together. Co-EMIB allows for the interconnection of two or more Foveros elements with essentially the performance of a single chip. And designers can also connect analog, memory and other tiles with very high bandwidth and at very low power.

  • ODI: Omni-Directional Interconnect provides even greater flexibility for communication among chiplets in a package. The top chip can communicate horizontally with other chiplets, similar to EMIB. It can also communicate vertically with through-silicon vias (TSVs) in the base die below, similar to Foveros. And ODI leverages large vertical vias to allow power delivery to the top die directly from the package substrate. Much larger than traditional TSVs, the large vias have lower resistance, providing more robust power delivery simultaneously with higher bandwidth and lower latency enabled through stacking. At the same time, this approach reduces the number of TSVs required in the base die, freeing up more area for active transistors and optimizing die size.

  • MDIO: Building upon its Advanced Interface Bus (AIB) PHY level interconnect, Intel disclosed a new die-to-die interface called MDIO. The technology enables a modular approach to system design with a library of chiplet intellectual property blocks. MDIO provides better power efficiency and more than double the pin speed and bandwidth density offered by AIB.
Collectively, these technologies are complementary tools in a powerful toolbox. When combined with Intel's process technologies, they form the underlying colour palette for the creativity of its chip architects - giving them the freedom to dream up new products.
Source: Intel

Back to Table of contents

Primeur weekly 2019-07-15

Quantum computing

Quantum chemistry on quantum computers ...

Quantum computing: Forschungszentrum Jülich and Google announce research partnership ...

The best of both worlds: how to solve real problems on modern quantum computers ...

Rigetti Computing acquires QxBranch to expand full-stack capabilities ...

Focus on Europe

Pioneer satellites launched ...

Inauguration of the Minho Advanced Computing Centre - MACC - in Portugal ...

e-InfraCentral reports on successful EOSC community event in Tallinn ...

ISC High Performance announces David Keyes as 2020 Programme Chair ...

GCS Centres converge on Frankfurt for ISC19 ...

Gauss Centre for Supercomputing to open 22nd call for large-scale projects ...

Middleware

Argonne team breaks record for Globus Data Movement ...

Hardware

Verne Global joins NVIDIA DGX-Ready Data Center Programme as HPC & AI colocation partner ...

NSF funds Bridges-2 supercomputer at Pittsburgh Supercomputing Center ...

Mellanox Capital extends storage ecosystem with investments in CNEX Labs and Pliops ...

Ohio Supercomputer Center staff leading programmes at PEARC19 conference ...

Tachyum closes $25 million Series A round ...

Vantage Data Centers joins NVIDIA DGX-Ready Data Center Colocation Programme ...

World-class research centre opens in Palo Alto ...

Intel's Pohoiki Beach, a 64-chip neuromorphic system, delivers breakthrough results in research tests ...

Applications

SDSC's Comet supercomputer used to model graphene-water interaction ...

US Naval Research Laboratory 'connects the dots' for quantum networks ...

Deep learning-powered 'DeepEC' helps accurately understand enzyme functions ...

Targeting new treatments for concussions by transforming brain pathology ...

NERSC's Cori system reveals integral role of gluons in proton pressure distribution ...

CMU scientists use XSEDE-allocated resources to simulate improved battery components ...

AI Excellence in Europe: 50 million euro to bring world-class researchers together ...

The Cloud

IBM closes landmark acquisition of Red Hat for $34 billion and defines open, hybrid Cloud future ...

USFlash

Intel unveils new tools in its advanced chip packaging toolbox ...