31 May 2011 Taipei - Super Micro Computer showed its newest SuperServers at Computex in Taipei, Taiwan. Its latest high-end GPU SuperServers pack 4 GPUs in 1U and for the for use in in high-density HPC, up to 6 GPUs in a slim 2U.
"Supermicro is excited to unveil our latest state-of-the-art server innovations at Computex 2011", stated Charles Liang, President and CEO of Supermicro. "Shaping the Future is the theme at Computex and our MicroCloud indeed reflects this by leading the industry with a new, high-performance independent node architecture. In addition, our new multi-GPU SuperServers take supercomputing to new levels with high-density, clusterable HPC solutions offering the best price/performance on the market."
Supermicro's innovative MicroCloud (5037MC-H8TRF), is a high-density, multi-node UP server with 8/16 hot-pluggable nodes and 16 hot-swappable HDDs in a compact 3U form factor. Each independent node supports an Intel Xeon E3-1200 processor and a PCI-E 2.0 x8 expansion slot. MicroCloud integrates advanced technologies within a compact functional design to deliver high performance in environments with space and power limitations. The entire system is designed with efficiency in mind from its ease of maintenance to its high-efficiency, redundant Platinum Level (94%+) power modules. These combined features provide a compelling, cost-effective solution for IT professionals implementing new hosting architectures for SMB and Public/Private Cloud Computing applications.
Supermicro's latest high-end GPU SuperServers pack an impressive 4 GPUs in 1U and for the ultimate in high-density HPC, up to 6 GPUs in a slim 2U. These enterprise-class SuperServers are powerful yet green, incorporating advanced energy-efficient components, optimized cooling designs and redundant Platinum Level (94%+) power supplies. They support NVIDIA CUDA architecture-based Tesla M2050, M2070 and M2090 GPUs to generate massively parallel processing power for compute-intensive HPC applications. Their high-performance, multi-TFLOPS capabilities are ideal for computation and dynamic modelling in scientific and engineering fields such as astronomy, life sciences, ecology, computational finance, CAE and CFD.