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Primeur weekly 2011-05-09

EuroFlash

Bright Cluster Manager chosen for TOP500-class HPC Cluster in France ...

Bull to issue key figures for the first quarter of 2011 ...

CA Technologies enables Logicalis UK to deliver flexible, efficient, and cost-effective Cloud computing services ...

Tiscali chooses Cisco Solutions to strengthen its backbone network and renew its data centre ...

Italtel and Cordys partners in Cloud computing ...

Oracle Next Generation Data Centre Index reveals businesses in Iberia, Italy and the Middle East are falling behind in sophistication of data centre usage ...

PRACE Research Infrastructure calls for One Year Project Grants on three Tier-0 Computers and pilots a synchronized Pilot Call for Tier-1 Grants ...

Single atom stores quantum information ...

USFlash

Cisco delivers Containerized Data Center ...

Study: Rare deep-sea starfish stuck in juvenile body plan ...

Explorys recognized by analyst firm as a Cool Vendor 2011 ...

HP launches early access programme for upcoming Enterprise Virtual Array ...

ISRO builds India's fastest supercomputer ...

Oracle unveils Oracle Health Sciences Cloud ...

Oracle SPARC servers demonstrate outstanding performance with new benchmark results ...

Platform Computing introduces comprehensive monitoring and analysis tools for Platform LSF environments ...

Several baffling puzzles in protein molecular structure solved with new method ...

New software to support interest in extreme science ...

Tokyo Institute of Technology to add CULA library to TSUBAME 2.0 ...

Tracker Software Products announces launch of new on-line PDF Viewer Cloud Applications ...

Windstream opens new data centre in Charlotte ...

Red Hat delivers the Platform-as-a-Service Cloud for open source developers ...

The SciNet Consortium at the University of Toronto selects NextIO vCORE Express 2070 GPU computing solutions ...

Intel reinvents transistors using new 3D structure ...

Red Hat Cloud helps customers build Infrastructure-as-a-Service Clouds with HP CloudSystem matrix and services ...

Intel reinvents transistors using new 3D structure

4 May 2011 Santa Clara - Intel Corporation has achieved a significant breakthrough in the evolution of the transistor, the microscopic building block of modern electronics. For the first time since the invention of silicon transistors over 50 years ago, transistors using a three-dimensional structure will be put into high-volume manufacturing. Intel will introduce a revolutionary 3D transistor design called Tri-Gate, first disclosed by Intel in 2002, into high-volume manufacturing at the 22-nanometer (nm) node in an Intel chip codenamed "Ivy Bridge". A nanometer is one-billionth of a meter.

The three-dimensional Tri-Gate transistors represent a fundamental departure from the two-dimensional planar transistor structure that has powered not only all computers, mobile phones and consumer electronics to-date, but also the electronic controls within cars, spacecraft, household appliances, medical devices and virtually thousands of other everyday devices for decades.

"Intel's scientists and engineers have once again reinvented the transistor, this time utilizing the third dimension", stated Intel President and CEO Paul Otellini. "Amazing, world-shaping devices will be created from this capability as we advance Moore's Law into new realms."

Scientists have long recognized the benefits of a 3D structure for sustaining the pace of Moore's Law as device dimensions become so small that physical laws become barriers to advancement. The key to today's breakthrough is Intel's ability to deploy its novel 3D Tri-Gate transistor design into high-volume manufacturing, ushering in the next era of Moore's Law and opening the door to a new generation of innovations across a broad spectrum of devices.

Moore's Law is a forecast for the pace of silicon technology development that states that roughly every 2 years transistor density will double, while increasing functionality and performance and decreasing costs. It has become the basic business model for the semiconductor industry for more than 40 years.

Intel's 3D Tri-Gate transistors enable chips to operate at lower voltage with lower leakage, providing an unprecedented combination of improved performance and energy efficiency compared to previous state-of-the-art transistors. The capabilities give chip designers the flexibility to choose transistors targeted for low power or high performance, depending on the application.

The 22nm 3D Tri-Gate transistors provide up to 37 percent performance increase at low voltage versus Intel's 32nm planar transistors. This incredible gain means that they are ideal for use in small handheld devices, which operate using less energy to "switch" back and forth. Alternatively, the new transistors consume less than half the power when at the same performance as 2D planar transistors on 32nm chips.

"The performance gains and power savings of Intel's unique 3D Tri-Gate transistors are like nothing we've seen before", stated Mark Bohr, Intel Senior Fellow. "This milestone is going further than simply keeping up with Moore's Law. The low-voltage and low-power benefits far exceed what we typically see from one process generation to the next. It will give product designers the flexibility to make current devices smarter and wholly new ones possible. We believe this breakthrough will extend Intel's lead even further over the rest of the semiconductor industry."

Transistors continue to get smaller, cheaper and more energy efficient in accordance with Moore's Law - named for Intel co-founder Gordon Moore. Because of this, Intel has been able to innovate and integrate, adding more features and computing cores to each chip, increasing performance, and decreasing manufacturing cost per transistor.

Sustaining the progress of Moore's Law becomes even more complex with the 22nm generation. Anticipating this, Intel research scientists in 2002 invented what they called a Tri-Gate transistor, named for the three sides of the gate. Today's announcement follows further years of development in Intel's highly co-ordinated research-development-manufacturing pipeline, and marks the implementation of this work for high-volume manufacturing.

The 3D Tri-Gate transistors are a reinvention of the transistor. The traditional "flat" two-dimensional planar gate is replaced with an incredibly thin three-dimensional silicon fin that rises up vertically from the silicon substrate. Control of current is accomplished by implementing a gate on each of the three sides of the fin - two on each side and one across the top - rather than just one on top, as is the case with the 2-D planar transistor. The additional control enables as much transistor current flowing as possible when the transistor is in the "on" state (for performance), and as close to zero as possible when it is in the "off" state (to minimize power), and enables the transistor to switch very quickly between the two states (again, for performance).

Just as skyscrapers let urban planners optimize available space by building upward, Intel's 3D Tri-Gate transistor structure provides a way to manage density. Since these fins are vertical in nature, transistors can be packed closer together, a critical component to the technological and economic benefits of Moore's Law. For future generations, designers also have the ability to continue growing the height of the fins to get even more performance and energy-efficiency gains.

"For years we have seen limits to how small transistors can get", stated Gordon Moore. "This change in the basic structure is a truly revolutionary approach, and one that should allow Moore's Law, and the historic pace of innovation, to continue."

The 3D Tri-Gate transistor will be implemented in the company's upcoming manufacturing process, called the 22nm node, in reference to the size of individual transistor features. More than 6 million 22nm Tri-Gate transistors could fit in the period at the end of this sentence.

Today, Intel demonstrated the world's first 22nm microprocessor, codenamed "Ivy Bridge", working in a laptop, server and desktop computer. Ivy Bridge-based Intel Core family processors will be the first high-volume chips to use 3D Tri-Gate transistors. Ivy Bridge is slated for high-volume production readiness by the end of this year.

This silicon technology breakthrough will also aid in the delivery of more highly integrated Intel Atom processor-based products that scale the performance, functionality and software compatibility of Intel architecture while meeting the overall power, cost and size requirements for a range of market segment needs.
Source: Intel

Back to Table of contents

Primeur weekly 2011-05-09

EuroFlash

Bright Cluster Manager chosen for TOP500-class HPC Cluster in France ...

Bull to issue key figures for the first quarter of 2011 ...

CA Technologies enables Logicalis UK to deliver flexible, efficient, and cost-effective Cloud computing services ...

Tiscali chooses Cisco Solutions to strengthen its backbone network and renew its data centre ...

Italtel and Cordys partners in Cloud computing ...

Oracle Next Generation Data Centre Index reveals businesses in Iberia, Italy and the Middle East are falling behind in sophistication of data centre usage ...

PRACE Research Infrastructure calls for One Year Project Grants on three Tier-0 Computers and pilots a synchronized Pilot Call for Tier-1 Grants ...

Single atom stores quantum information ...

USFlash

Cisco delivers Containerized Data Center ...

Study: Rare deep-sea starfish stuck in juvenile body plan ...

Explorys recognized by analyst firm as a Cool Vendor 2011 ...

HP launches early access programme for upcoming Enterprise Virtual Array ...

ISRO builds India's fastest supercomputer ...

Oracle unveils Oracle Health Sciences Cloud ...

Oracle SPARC servers demonstrate outstanding performance with new benchmark results ...

Platform Computing introduces comprehensive monitoring and analysis tools for Platform LSF environments ...

Several baffling puzzles in protein molecular structure solved with new method ...

New software to support interest in extreme science ...

Tokyo Institute of Technology to add CULA library to TSUBAME 2.0 ...

Tracker Software Products announces launch of new on-line PDF Viewer Cloud Applications ...

Windstream opens new data centre in Charlotte ...

Red Hat delivers the Platform-as-a-Service Cloud for open source developers ...

The SciNet Consortium at the University of Toronto selects NextIO vCORE Express 2070 GPU computing solutions ...

Intel reinvents transistors using new 3D structure ...

Red Hat Cloud helps customers build Infrastructure-as-a-Service Clouds with HP CloudSystem matrix and services ...