Now customers can use trusted IT racks from Rittal combined with the innovative direct-on-chip evaporative cooling solution from ZutaCore to meet and surpass the challenges posed by server-level hot spots and edge computing requirements, while mitigating the risk of IT failure. Furthermore, two-phase liquid cooling is prepared for any evolution in high-powered chips, as there is no limit to what it can cool as processors progress upwards of 900W.
"The mass adoption of direct liquid cooling in data centers becomes inevitable once we consider semiconductor trends, data center economics and sustainability goals in the 2020s", stated Daniel Bizo, principal analyst, 451 Research. "Air cooling alone wont be able to meet all requirements in a future when mainstream server processors can generate more heat than an entire server a few years ago, yet cost pressure and expectations around environmental sustainability will only be higher. Data centres will need to keep up with new power-hungry chips at low cost and low energy overhead."
"This solution directly addresses demands weve had from hyperscale and colocation companies for cooling solutions that go beyond the limits of air and eliminate the use of water", stated Luis Bruecher, Vice President Product Management IT, Rittal. "As a leading global systems provider, we aim to deliver best-in-class solutions. The Rittal HPC cooled-by-ZutaCore solutions will leverage added value for our clients."
Industry leading LCP system technologies from Rittal are complementary to ZutaCore's HyperCool technology. This hybrid system allows data center operators to gain energy efficiency as the hybrid system efficiently removes heat from high flux devices using two-phase cooling, leaving the low flux devices to be cooled by air. Together they can alleviate cooling boundaries from hot spots to the edge, consistently, in any climate, from the CPU level through to a server, rack and data center levels. The RDA solution addresses the need for a cost effective way to cool high-powered processors that present major challenges to typical air-conditioning systems. The air-cooled In-Rack Edge needs no plumbing or special environment outside of the rack. This makes it ideal for solving problems in traditional air-cooled data centers that need to incorporate higher power density in servers and in racks.
"By partnering with Rittal to bring our direct-on-chip cooling solutions to market, we can now answer the demand we've already seen and scale to provide this technology to some of the industry's largest and most demanding data centre operators", stated Udi Paret, President, ZutaCore. "From search engine and social media companies to hyperscale and colocation providers, the Rittal HPC cooled-by-ZutaCore solutions bring the unique benefits of Rittals modular system technology alongside waterless liquid cooling for unparalleled heat dissipation. This is the only system on the market that can easily enable users to deploy the latest, most powerful processors in data centres. And in particular where facility water is not readily available."
Due to the cancellation of OCP Global Summit, which was to be the world premier of the interactive Rittal HPC Cooled-by-ZutaCore demo, Rittal and ZutaCore will soon announce a virtual opportunity to learn more about their joint product pipeline. Participants will learn more about how the two partners are addressing demands from hyperscale and colocation companies. The partners will outline a future scaling strategy to continue providing flexible solutions for both new and retrofit projects.