"Silicon photonics is the enabling technology for 200Gb/s InfiniBand and Ethernet networks", stated Amir Prescher, executive vice president of business development and interconnect products at Mellanox. "The QSFP56 doubles the front panel density for next generation switches; enables 200G copper DACs and 50G breakout cables for adapters and inside-the-rack applications; and silicon photonics transceivers supports all data centre reaches to 2km."
Mellanox plans to offer 50Gb/s and 200Gb/s Direct Attach Copper cables (DACs); copper splitter cables (QSFP56 to 4x SFP56); silicon photonics based AOCs for reaches to 200m; and silicon photonics transceivers for reaches to 2km. Mellanox 200Gb/s cables and transceivers will seamlessly support previous generations of 40 and 100Gb/s networks.
"The transition from 40G to 100G networks inside the data centre has begun in earnest", stated Dale Murray, principal analyst at LightCounting Market Research. "This announcement comes just as the Cloud and hyperscalers are planning their migration to 200G and 400G."
Mellanox's extensive LinkX interconnect product family includes 10, 40, 25, 50 and 100Gb/s copper cables, active optical cables and transceivers for both single mode fiber and multi-mode fiber applications. The newest LinkX additions, introduced at OFC 2016, are 25Gb/s transceivers and Active Optical cables, and use the SFP28 form factor.