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Primeur weekly 2015-03-30

Exascale supercomputing

PRACEdays15 to include EESI2 Final Conference, Women in HPC, and Enabling Exascale in Europe ...

The Cloud

HP delivers first fully-configured and integrated OpenStack and Cloud Foundry-based private Cloud ...

Desktop Grids

BOINC 7.4.42 released to the public ...

EuroFlash

Altair Engineering announces keynote speakers from Airbus, Jaguar Land Rover and Bloodhound SSC to present at the 9th UK Altair Technology Conference ...

UK Atomic Weapons Establishment awards SGI contract to support research with new SGI ICE XA systems ...

Cray to deliver five-petaflop supercomputer and high-performance storage system to Petroleum Geo-Services ...

Theory of the Strong Interaction verified - Supercomputer calculates mass difference between neutron and proton ...

Lenovo opens first global High Performance Computing innovation centre in Germany ...

A rehearsal space with musicians 2,700 kilometers apart from each other ...

A first glimpse inside a macroscopic quantum state ...

USFlash

Automotive, aerospace and defense take centre stage at the 2015 Americas Altair Technology Conference ...

Big Data allows computer engineers to find genetic clues in humans ...

SGI delivers cutting-edge supercomputer to the National Institute for Materials Science ...

Supercomputers give universities a competitive edge, researchers find ...

Engineers develop new methods to speed up simulations in computational grand challenge ...

Micron and Intel unveil new 3D NAND flash memory ...

India's National Supercomputing Mission (NSM): Building capacity and capability to be jointly implemented by the Department of Science and Technology and Department of Electronics and Information Technology ...

U.S. Army improves systems testing to deliver more capability to fight ...

Quantum compute this - WSU mathematicians build code to take on toughest of cyber attacks ...

IBM invests in Modernizing Medicine to accelerate adoption of Watson technologies in health care ...

Quantum correlation can imply causation ...

From programmable backbones to advanced 'apps': An end-to-end vision of the future Internet ...

Building shape inspires new material discovery ...

UW scientists build a nanolaser using a single atomic sheet ...

OpenPOWER Foundation technology leaders unveil hardware solutions to deliver new server alternatives ...

Micron and Intel unveil new 3D NAND flash memory


26 Mar 2015 Boise, Santa Clara - Micron Technology Inc. and Intel Corporation have revealed the availability of their 3D NAND technology, the world's highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centres, and nearly every cellphone, tablet and mobile device.

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

Planar NAND flash memory is nearing its practical scaling limits, posing significant challenges for the memory industry. 3D NAND technology is poised to make a dramatic impact by keeping flash storage solutions aligned with Moore's Law, the trajectory for continued performance gains and cost savings, driving more widespread use of flash storage.

"Micron and Intel's collaboration has created an industry-leading solid-state storage technology that offers high density, performance and efficiency and is unmatched by any flash today", stated Brian Shirley, vice president of Memory Technology and Solutions at Micron Technology. "This 3D NAND technology has the potential to create fundamental market shifts. The depth of the impact that flash has had to date - from smartphones to flash-optimized supercomputing - is really just scratching the surface of what's possible."

"Intel's development efforts with Micron reflect our continued commitment to offer leading and innovative non-volatile memory technologies to the marketplace", stated Rob Crooke, senior vice president and general manager, Non-Volatile Memory Solutions Group, Intel Corporation. "The significant improvements in density and cost enabled by our new 3D NAND technology innovation will accelerate solid-state storage in computing platforms."

One of the most significant aspects of this technology is in the foundational memory cell itself. Intel and Micron chose to use a floating gate cell, a universally utilized design refined through years of high-volume planar flash manufacturing. This is the first use of a floating gate cell in 3D NAND, which was a key design choice to enable greater performance and increase quality and reliability.

The new 3D NAND technology stacks flash cells vertically in 32 layers to achieve 256Gb multilevel cell (MLC) and 384Gb triple-level cell (TLC) die that fit within a standard package. These capacities can enable gum stick-sized SSDs with more than 3.5TB of storage and standard 2.5-inch SSDs with greater than 10TB. Because capacity is achieved by stacking cells vertically, the individual cell dimensions can be considerably larger. This is expected to increase both performance and endurance and make even the TLC designs well-suited for data centre storage.

The key product features of this 3D NAND design include:

  • Large Capacities: Three times the capacity of existing 3D technology, up to 48GB of NAND per die, enabling three-fourths of a terabyte to fit in a single fingertip-sized package.
  • Reduced Cost per GB: First-generation 3D NAND is architected to achieve better cost efficiencies than planar NAND.
  • Fast: High read/write bandwidth, I/O speeds and random read performance.
  • Green: New sleep modes enable low-power use by cutting power to inactive NAND die (even when other die in the same package are active), dropping power consumption significantly in standby mode.
  • Smart: Innovative new features improve latency and increase endurance over previous generations, and also make system integration easier.
The 256Gb MLC version of 3D NAND is sampling with select partners today, and the 384Gb TLC design will be sampling later this spring. The fab production line has already begun initial runs, and both devices will be in full production by the fourth quarter of this year. Both companies are also developing individual lines of SSD solutions based on 3D NAND technology and expect those products to be available within the next year.
Source: Intel

Back to Table of contents

Primeur weekly 2015-03-30

Exascale supercomputing

PRACEdays15 to include EESI2 Final Conference, Women in HPC, and Enabling Exascale in Europe ...

The Cloud

HP delivers first fully-configured and integrated OpenStack and Cloud Foundry-based private Cloud ...

Desktop Grids

BOINC 7.4.42 released to the public ...

EuroFlash

Altair Engineering announces keynote speakers from Airbus, Jaguar Land Rover and Bloodhound SSC to present at the 9th UK Altair Technology Conference ...

UK Atomic Weapons Establishment awards SGI contract to support research with new SGI ICE XA systems ...

Cray to deliver five-petaflop supercomputer and high-performance storage system to Petroleum Geo-Services ...

Theory of the Strong Interaction verified - Supercomputer calculates mass difference between neutron and proton ...

Lenovo opens first global High Performance Computing innovation centre in Germany ...

A rehearsal space with musicians 2,700 kilometers apart from each other ...

A first glimpse inside a macroscopic quantum state ...

USFlash

Automotive, aerospace and defense take centre stage at the 2015 Americas Altair Technology Conference ...

Big Data allows computer engineers to find genetic clues in humans ...

SGI delivers cutting-edge supercomputer to the National Institute for Materials Science ...

Supercomputers give universities a competitive edge, researchers find ...

Engineers develop new methods to speed up simulations in computational grand challenge ...

Micron and Intel unveil new 3D NAND flash memory ...

India's National Supercomputing Mission (NSM): Building capacity and capability to be jointly implemented by the Department of Science and Technology and Department of Electronics and Information Technology ...

U.S. Army improves systems testing to deliver more capability to fight ...

Quantum compute this - WSU mathematicians build code to take on toughest of cyber attacks ...

IBM invests in Modernizing Medicine to accelerate adoption of Watson technologies in health care ...

Quantum correlation can imply causation ...

From programmable backbones to advanced 'apps': An end-to-end vision of the future Internet ...

Building shape inspires new material discovery ...

UW scientists build a nanolaser using a single atomic sheet ...

OpenPOWER Foundation technology leaders unveil hardware solutions to deliver new server alternatives ...