Back to Table of contents

Primeur weekly 2020-02-10

Exascale supercomputing

Tachyum's reference design will be used in a 2021 AI/HPC supercomputer ...

Quantum computing

Forschungszentrum Jülich to establish technology laboratory for quantum computers ...

FEFU scientists developed method to build up functional elements of quantum computers ...

New quantum switch turns metals into insulators ...

Focus on Europe

International Advanced Research Workshop on High Performance Computing to issue Call for Participation ...

EPSRC appoints Mark Parsons Director of Research Computing ...

e-IRG Workshop "Grand challenges of e-Infrastructures within the new ERA" to issue Call for Participation ...

BigDFT4CHEM wins the EXDCI Call for Spin-off Initiatives (SPI) ...

Eni unveils its new supercomputing system HPC5, the world's most powerful for industrial use ...

Tachyum CEO Dr. Radoslav Danilak discusses 'Bringing Slovakia to the Forefront of the Digital Age' at CEO Forum ...

Middleware

KU Leuven joins the iRODS Consortium ...

Sylabs has released SingularityPRO 3.5 ...

Hardware

DDN named finalist in Storage Magazine and SearchStorage 2019 Products of the Year awards ...

Fujitsu receives supercomputer order from Nagoya University's Information Technology Center ...

Controlling light with light ...

WekaIO recognized as a coolest Cloud company by CRN ...

Samsung to Advance High Performance Computing Systems with Launch of Industry's First 3rd-generation (16GB) HBM2E ...

Xperi enters into new patent and technology license agreement with SK hynix ...

Supermicro announces second quarter fiscal 2020 financial results ...

Applications

BSC European supercomputing centre that most has contributed to Pan-Cancer ...

March 2020 HPC User Forum will showcase AI, energy research and other HPC areas ...

Deep learning accurately forecasts heat waves and cold spells ...

Retina-inspired carbon nitride-based photonic synapses for selective detection of UV light ...

Computer simulation for understanding brain cancer growth ...

Gordon examining secure computation ...

Fusion squeeze, global image mapping, computing mental health, and Na+ batteries at Oak Ridge National Laboratory ...

SDSC supercomputer models improve Oregon/Washington coastal forecasts ...

Protein Data Bank archive adds new coronavirus protease structure ...

Xperi enters into new patent and technology license agreement with SK hynix

6 Feb 2020 San Jose - Xperi Corporation has entered into a new patent and technology license agreement with SK hynix, one of the world's largest semiconductor manufacturers. The agreement includes access to Xperi's broad portfolio of semiconductor intellectual property (IP) and a technology transfer of Invensas DBI Ultra 3D interconnect technology focused on next-generation memory.

"We are delighted to announce the extension of our long-standing relationship with SK hynix, a world-renowned technology leader and manufacturer of memory solutions", stated Craig Mitchell, President of Invensas, a wholly owned subsidiary of Xperi Corporation. "As the industry increasingly looks beyond conventional node scaling and turns toward hybrid bonding, Invensas stands as a pioneering leader that continues to deliver improved performance, power, and functionality, while also reducing the cost of semiconductors. We are proud to partner with SK hynix to further develop and commercialize our DBI Ultra technology and look forward to a wide range of memory solutions that leverage the benefits of this revolutionary technology platform."

DBI Ultra is a patented die-to-wafer hybrid bonding 3D interconnect technology platform ushering in a new era of homogeneous and heterogeneous 3D integration. It allows the semiconductor industry to extend beyond Moore's Law, providing unprecedented 2.5D and 3D integration flexibility. Among a wide range of applications, DBI Ultra makes it possible to manufacture 8-, 12- and even 16-high chip stacks while meeting the demanding packaging height and performance requirements for next generation, high-performance computing.

DBI wafer-to-wafer hybrid bonding, the predecessor to DBI Ultra, is already successfully incorporated into image sensors and RF components shipping in hundreds of millions of smartphones around the world. DBI Ultra is poised to realize similar success in 3D stacked memory as well as in 2.5D and 3D applications requiring the integration of memory with CPUs, GPUs, FPGAs, or SoCs. When optimized and applied by an industry leader like SK hynix, these technologies and the resulting semiconductor products will enable solutions for a wide range of applications from smartphones and smart homes to artificial intelligence (AI) and Big Data.

The terms and conditions of the agreement are confidential.

Source: Xperi Corporation

Back to Table of contents

Primeur weekly 2020-02-10

Exascale supercomputing

Tachyum's reference design will be used in a 2021 AI/HPC supercomputer ...

Quantum computing

Forschungszentrum Jülich to establish technology laboratory for quantum computers ...

FEFU scientists developed method to build up functional elements of quantum computers ...

New quantum switch turns metals into insulators ...

Focus on Europe

International Advanced Research Workshop on High Performance Computing to issue Call for Participation ...

EPSRC appoints Mark Parsons Director of Research Computing ...

e-IRG Workshop "Grand challenges of e-Infrastructures within the new ERA" to issue Call for Participation ...

BigDFT4CHEM wins the EXDCI Call for Spin-off Initiatives (SPI) ...

Eni unveils its new supercomputing system HPC5, the world's most powerful for industrial use ...

Tachyum CEO Dr. Radoslav Danilak discusses 'Bringing Slovakia to the Forefront of the Digital Age' at CEO Forum ...

Middleware

KU Leuven joins the iRODS Consortium ...

Sylabs has released SingularityPRO 3.5 ...

Hardware

DDN named finalist in Storage Magazine and SearchStorage 2019 Products of the Year awards ...

Fujitsu receives supercomputer order from Nagoya University's Information Technology Center ...

Controlling light with light ...

WekaIO recognized as a coolest Cloud company by CRN ...

Samsung to Advance High Performance Computing Systems with Launch of Industry's First 3rd-generation (16GB) HBM2E ...

Xperi enters into new patent and technology license agreement with SK hynix ...

Supermicro announces second quarter fiscal 2020 financial results ...

Applications

BSC European supercomputing centre that most has contributed to Pan-Cancer ...

March 2020 HPC User Forum will showcase AI, energy research and other HPC areas ...

Deep learning accurately forecasts heat waves and cold spells ...

Retina-inspired carbon nitride-based photonic synapses for selective detection of UV light ...

Computer simulation for understanding brain cancer growth ...

Gordon examining secure computation ...

Fusion squeeze, global image mapping, computing mental health, and Na+ batteries at Oak Ridge National Laboratory ...

SDSC supercomputer models improve Oregon/Washington coastal forecasts ...

Protein Data Bank archive adds new coronavirus protease structure ...