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Primeur weekly 2018-01-22

Focus

European Commission explains why Joint Undertaking is well suited as legal instrument to help create EuroHPC ecosystem ...

Exascale supercomputing

Exascale architectures lead to greener and more advanced combustion systems ...

Call for Proposals: Aurora Early Science Programme expands to include data and learning projects ...

Quantum computing

HKU quantum physicist Dr. Giulio Chiribella receives Croucher Senior Research Fellowship 2018 ...

New input for quantum simulations ...

Focus on Europe

Eni boots up HPC4 and makes its computing system the world's most powerful in the industry ...

ONERA to install new supercomputer for aerospace research ...

Atos to deliver the most powerful supercomputer in Germany at Forschungszentrum Jülich ...

Hardware

Cray announces selected preliminary 2017 financial results ...

India's Ministry of Earth Sciences deploys new Cray XC40 supercomputers and Cray storage systems ...

University of Virginia Engineering tapped to lead $27.5 million centre to reinvent computing ...

Asperitas creates AsperitasEI business unit to bring circular energy and data centre projects to life ...

CSRA selects edge solutions and Supermicro computer for expansion, increasing NASA computing capacity to 5 petaFLOPS ...

Mellanox ConnectX-5 Ethernet adapter wins Linley Group Analyst Choice Award for Best Networking Chip ...

Notre Dame to lead $26 million multi-university research centre developing next-generation computing technologies ...

New $32 million centre at University of Michigan reimagines how computers are designed ...

New C-BRIC centre will tackle brain-inspired computing ...

Ultra-thin memory storage device paves way for more powerful computing ...

Applications

US DOE announces funding for new HPC4Manufacturing industry projects ...

NOAA kicks off 2018 with massive supercomputer upgrade ...

UMass Center for Data Science partners with Chan Zuckerberg Initiative to accelerate science and medicine ...

Himawari-8 data assimilated simulation enables 10-minute updates of rain and flood predictions ...

Ohio Supercomputer Center to host free webinar on innovative web-based HPC portal ...

2D tin (stanene) without buckling: A possible topological insulator ...

Uncovering decades of questionable investments ...

Groundbreaking conference examines how AI transforms our world ...

Framework for Research Data Management makes life simpler for researchers ...

The Cloud

New centre headquartered at Carnegie Mellon will build smarter networks to connect edge devices to the Cloud ...

IBM and Salesforce strengthen strategic partnership ...

ANSYS and Rescale offer on-demand, pay-per-use ANSYS software on Rescale's ScaleX Cloud HPC platform ...

US DOE announces funding for new HPC4Manufacturing industry projects


The Department of Energy's (DOE) Advanced Manufacturing Office has announced $1.87 million in funding for seven new industry projects under an ongoing initiative designed to utilize DOE's high-performance computing resources and expertise to advance U.S. manufacturing and clean-energy technologies.
11 Jan 2018 Livermore - The US Department of Energy's (DOE) Advanced Manufacturing Office (AMO) will fund $1.87 million for seven new industry projects under an ongoing initiative designed to utilize DOE's high-performance computing (HPC) resources and expertise to advance U.S. manufacturing and clean-energy technologies.

The projects mark the fourth round of awardees under the HPC4Manufacturing (HPC4Mfg) programme since it was initiated in 2015. The programme, led by Lawrence Livermore National Laboratory (LLNL), Oak Ridge National Laboratory (ORNL) and Lawrence Berkeley National Laboratory (LBNL), teams DOE's national laboratories with U.S. manufacturers to address complex challenges with high-performance computing, including improving energy efficiency, reducing emissions, and maintaining American competitiveness. In addition to projects at the three leading laboratories, HPC4Mfg includes projects with Argonne National Laboratory (ANL), the National Renewable Energy Lab (NREL), the National Energy Technology Lab (NETL) and Sandia National Laboratories (SNL). Sandia is a new participant in the programme.

"We are excited that HPC is gaining traction in the manufacturing section, as evidenced by the large number of proposals received in this solicitation - a 50 percent increase compared to previous solicitations", stated Lori Diachin, director of the HPC4Mfg programme. "This led to an outstanding set of funded projects."

The seven projects awarded funding under the latest HPC4Mfg round include: LLNL partnering with Vitro Flat Glass to develop a neural network model for glass furnace operations; LBNL collaborating with PPG Industries to optimize rotary bell atomization; ORNL working with Eaton Corporation to enable next-generation low-temperature waste heat recovery; and SNL partnering with Vader Systems on computational modelling of liquid-metal 3D printing.

For the fifth project, ANL will partner with Caterpillar to optimize heavy-duty diesel engines for reduced emissions and improved fuel economy. The sixth project is led by General Motors, who will partner with LLNL to develop new models of high-pressure resin transfer molding to reduce the cost of manufacturing automotive structural carbon composites. Both projects are co-funded by the AMO and the Vehicle Technology Office (VTO) in DOE's Energy Efficiency and Renewable Energy Office, which is putting $350,000 toward the efforts.

The seventh project is led by Arconic, who will work with LLNL and ORNL to improve microstructure modelling of additively manufactured metal parts. The project is funded jointly by DOE's Office of Fossil Energy and the AMO, and is one of the first projects under the new HPC4Materials programme, aimed at accelerating industry discovery, design and development of new or modified materials for severe environments.

The Advanced Manufacturing Office within DOE's Office of Energy Efficiency and Renewable Energy funded LLNL to establish the HPC4Mfg Programme in 2015. To date, the programme has provided approximately $15 million in funding for a total of 47 private-public projects, ranging from improving energy efficiency in paper making and automobile engines to improving the reliability of wind turbines and reducing defects in 3D-printed parts. Under the program, industry partners provide in-kind contributions of at least 20 percent of the total project budget. The next round of solicitations will take place in early 2018.

The compute resources for this programme are provided through a variety of mechanisms, including the Advanced Scientific Computing Research Program within DOE's Office of Science Leadership Computing Challenge allocation program, allocations at NREL, NETL and other NNSA laboratories.

The full list of projects is available at the HPC4Mfg website.
Source: DOE/Lawrence Livermore National Laboratory

Back to Table of contents

Primeur weekly 2018-01-22

Focus

European Commission explains why Joint Undertaking is well suited as legal instrument to help create EuroHPC ecosystem ...

Exascale supercomputing

Exascale architectures lead to greener and more advanced combustion systems ...

Call for Proposals: Aurora Early Science Programme expands to include data and learning projects ...

Quantum computing

HKU quantum physicist Dr. Giulio Chiribella receives Croucher Senior Research Fellowship 2018 ...

New input for quantum simulations ...

Focus on Europe

Eni boots up HPC4 and makes its computing system the world's most powerful in the industry ...

ONERA to install new supercomputer for aerospace research ...

Atos to deliver the most powerful supercomputer in Germany at Forschungszentrum Jülich ...

Hardware

Cray announces selected preliminary 2017 financial results ...

India's Ministry of Earth Sciences deploys new Cray XC40 supercomputers and Cray storage systems ...

University of Virginia Engineering tapped to lead $27.5 million centre to reinvent computing ...

Asperitas creates AsperitasEI business unit to bring circular energy and data centre projects to life ...

CSRA selects edge solutions and Supermicro computer for expansion, increasing NASA computing capacity to 5 petaFLOPS ...

Mellanox ConnectX-5 Ethernet adapter wins Linley Group Analyst Choice Award for Best Networking Chip ...

Notre Dame to lead $26 million multi-university research centre developing next-generation computing technologies ...

New $32 million centre at University of Michigan reimagines how computers are designed ...

New C-BRIC centre will tackle brain-inspired computing ...

Ultra-thin memory storage device paves way for more powerful computing ...

Applications

US DOE announces funding for new HPC4Manufacturing industry projects ...

NOAA kicks off 2018 with massive supercomputer upgrade ...

UMass Center for Data Science partners with Chan Zuckerberg Initiative to accelerate science and medicine ...

Himawari-8 data assimilated simulation enables 10-minute updates of rain and flood predictions ...

Ohio Supercomputer Center to host free webinar on innovative web-based HPC portal ...

2D tin (stanene) without buckling: A possible topological insulator ...

Uncovering decades of questionable investments ...

Groundbreaking conference examines how AI transforms our world ...

Framework for Research Data Management makes life simpler for researchers ...

The Cloud

New centre headquartered at Carnegie Mellon will build smarter networks to connect edge devices to the Cloud ...

IBM and Salesforce strengthen strategic partnership ...

ANSYS and Rescale offer on-demand, pay-per-use ANSYS software on Rescale's ScaleX Cloud HPC platform ...