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Primeur weekly 2011-12-05

The Cloud

Oracle delivers best four processor result on TPC-H Benchmark at three TB scale factor ...

Oracle Solaris 11 Training and Certification Programmes help customers and partners quickly embrace the Cloud ...

Oracle announces availability of Oracle WebLogic Server 12c ...

HP powers move to Cloud for enterprises and service providers ...

Cloud computing speeds up problem solving and saves energy ...

China Intelligence signs $1.5 million contract with China Southern Power Grid ...

HP and Alcatel-Lucent bring together the power of data centre technology and communications networks ...

EuroFlash

Cancer Research UK achieves scientific breakthroughs with Platform Computing ...

Warwick's supercomputer seeks way to mimic mollusc shell ...

GBP 158 million investment in e-infrastructure to power growth and innovation ...

BCNET deploys ADVA FSP 3000 in British Columbia Research & Education Network ...

ADVA Optical Networking announces first 10Gbit/s Etherjack demarcation device ...

ADVA Optical Networking and IBM introduce industry's first qualified solution for zEnterprise Bladecenter Extension (zBX) ...

ADVA Optical Networking and P&TLuxembourg deploy region's first high-end parallel Sysplex over InfiniBand service ...

Climate models run supercomputer catwalk ...

IBM opens its first Romanian product development facility for systems networking ...

The shadows in a city reveal its energy flow ...

USFlash

Cray to provide a 400 Tflop/s supercomputer to Kyoto University's Academic Center for Computing and Media Studies ...

Pittsburgh Supercomputing Center collaborates with SGI on shared-memory enhancements ...

SDSC researcher Amarnath Gupta named an ACM Distinguished Scientist ...

Green500 shows continuing trend toward environmentally friendly supercomputers ...

Researchers tout co-design approach for ultra-efficient supercomputing ...

Purdue builds nation's fastest campus supercomputer ...

IBM to produce Micron's Hybrid Memory Cube in debut of first commercial, 3D chip-making capability ...

C-DAC bags International Data Corporation (IDC) HPC Innovation Excellence Award ...

IBM to produce Micron's Hybrid Memory Cube in debut of first commercial, 3D chip-making capability

1 Dec 2011 Boise - IBM and Micron Technology Inc. will begin production of a new memory device built using the first commercial CMOS manufacturing technology to employ through-silicon vias (TSVs). IBM's advanced TSV chip-making process enables Micron's Hybrid Memory Cube (HMC) to achieve speeds 15 times faster than today's technology.

IBM will present the details of its TSV manufacturing breakthrough at the IEEE International Electron Devices Meeting on December 5 in Washington, DC.

HMC parts will be manufactured at IBM's advanced semiconductor fab in East Fishkill, New York, using the company's 32nm, high-K metal gate process technology.

HMC technology uses advanced TSVs - vertical conduits that electrically connect a stack of individual chips - to combine high-performance logic with Micron's state-of-the-art DRAM. HMC delivers bandwidth and efficiencies a leap beyond current device capabilities. HMC prototypes, for example, clock in with bandwidth of 128 gigabytes per second (GB/s). By comparison, current state-of-the-art devices deliver 12.8 GB/s. HMC also requires 70 percent less energy to transfer data while offering a small form factor - just 10 percent of the footprint of conventional memory.

HMC will enable a new generation of performance in applications ranging from large-scale networking and high-performance computing, to industrial automation and, eventually, consumer products.

"This is a milestone in the industry move to 3D semiconductor manufacturing", stated Subu Iyer, IBM Fellow. "The manufacturing process we are rolling out will have applications beyond memory, enabling other industry segments as well. In the next few years, 3D chip technology will make its way into consumer products, and we can expect to see drastic improvements in battery life and functionality of devices."

"HMC is a game changer, finally giving architects a flexible memory solution that scales bandwidth while addressing power efficiency", stated Robert Feurle, Vice President of DRAM Marketing for Micron. "Through collaboration with IBM, Micron will provide the industry's most capable memory offering."
Source: IBM

Back to Table of contents

Primeur weekly 2011-12-05

The Cloud

Oracle delivers best four processor result on TPC-H Benchmark at three TB scale factor ...

Oracle Solaris 11 Training and Certification Programmes help customers and partners quickly embrace the Cloud ...

Oracle announces availability of Oracle WebLogic Server 12c ...

HP powers move to Cloud for enterprises and service providers ...

Cloud computing speeds up problem solving and saves energy ...

China Intelligence signs $1.5 million contract with China Southern Power Grid ...

HP and Alcatel-Lucent bring together the power of data centre technology and communications networks ...

EuroFlash

Cancer Research UK achieves scientific breakthroughs with Platform Computing ...

Warwick's supercomputer seeks way to mimic mollusc shell ...

GBP 158 million investment in e-infrastructure to power growth and innovation ...

BCNET deploys ADVA FSP 3000 in British Columbia Research & Education Network ...

ADVA Optical Networking announces first 10Gbit/s Etherjack demarcation device ...

ADVA Optical Networking and IBM introduce industry's first qualified solution for zEnterprise Bladecenter Extension (zBX) ...

ADVA Optical Networking and P&TLuxembourg deploy region's first high-end parallel Sysplex over InfiniBand service ...

Climate models run supercomputer catwalk ...

IBM opens its first Romanian product development facility for systems networking ...

The shadows in a city reveal its energy flow ...

USFlash

Cray to provide a 400 Tflop/s supercomputer to Kyoto University's Academic Center for Computing and Media Studies ...

Pittsburgh Supercomputing Center collaborates with SGI on shared-memory enhancements ...

SDSC researcher Amarnath Gupta named an ACM Distinguished Scientist ...

Green500 shows continuing trend toward environmentally friendly supercomputers ...

Researchers tout co-design approach for ultra-efficient supercomputing ...

Purdue builds nation's fastest campus supercomputer ...

IBM to produce Micron's Hybrid Memory Cube in debut of first commercial, 3D chip-making capability ...

C-DAC bags International Data Corporation (IDC) HPC Innovation Excellence Award ...