19 Jun 2017 Frankfurt - CoolIT Systems Inc., a global expert in efficient liquid cooling technologies for HPC, Cloud and Enterprise markets, is returning to the International Supercomputing Conference - High Performance (ISC17) in Frankfurt as a Bronze Sponsor and Exhibitor for the sixth consecutive year. ISC17 will feature a large range of HPC vendors, universities and research organisations gathering from around the world during June 19-21, 2017. CoolIT will be showcasing a range of new liquid cooling innovations including new server solutions for Dell EMC and Hewlett Packard Enterprise plus a full range of liquid cooling infrastructure products.
Vendor displays will include CoolIT's OEM Blind-mate Blade Server Solution featuring 100% dry-break Stäubli quick disconnects. Blind-mate solutions feature easy operation for a reliable liquid connection and disconnection of servers from their chassis.
Chip-to-Atmosphere data centre cooling will be featured in partnership with STULZ. Demonstrated within a Micro Data Center, the unified solution effectively manages heat loads from the processor level with liquid cooling through to the outside atmosphere.
Dell EMC and HPE and other servers will be featured in the CoolIT booth including the following:
In partnership with STULZ, CoolIT will host an ISC17 Exhibitor Forum presentation on high-density Chip-to-Atmosphere data centre cooling solutions on June 20 at 4:40PM. CoolIT encourages all attendees to join the "From Chip to Atmosphere - The Future of Data Center Cooling" presentation at booth #M-210. During the session, Joerg Desler, President of STULZ Air Technology Systems Inc. and Geoff Lyon, CEO and CTO at CoolIT Systems, will be educating visitors on how to put heat to use, with main discussion revolving around the efficiency gains and performance enhancements of HPC made possible by liquid cooling solutions.
In response to recent chip advancements, liquid cooling solutions for the latest high TDP processors will be revealed. These include CoolIT's RX1 passive coldplate specifically designed for Intel Xeon Processor Scalable Family, and GP1 passive coldplate for NVIDIA Tesla P100.
CoolIT's complete range of liquid-to-liquid heat exchangers will be on display, including the stand-alone CHx650, and the CHx80 for customers to review. Accompanying these will be CoolIT's next generation liquid-to-air CDU, code-named 'AHx Panorama', a 5u AHx capable of managing 7-10kW per rack without facility water.
CoolIT will be featuring a case study for the exceptionally green data centre cooling solution at the Poznan Supercomputing & Networking Center (PSNC). The PSNC "Eagle" cluster uses 1,232 liquid cooled Huawei CH121 servers to increase density and reduce energy consumption. PSNC was able to deploy this new cluster within their existing data centre without having to invest in additional air cooling infrastructure. The heated liquid is also being reused for local heating needs.
In partnership with Boston and NVIDIA, CoolIT is supporting the University of Edinburgh EPCC team in the ISC17 Student Cluster Competition with a liquid cooled solution for their cluster configuration.
To learn more about how CoolIT' products and solutions maximize data centre performance and efficiency whilst significantly reducing OPEX and overall TCO, you can visit ISC17 booth C-1210. Executives and technical staff will be on site to guide attendees through new product showcases, live demos and customer case studies to aid in showcasing the benefits of liquid cooling in real time.