Asetek will showcase solutions in use and being installed at HPC sites worldwide from OEMs such as Cray, Fujitsu, Format, Penguin. Liquid cooling for IBM/OpenPower, NVIDIA Pascal and node-level liquid cooling for Intel Knight's Landing will also be on display.
"Since ISC15, the acceleration and adoption of Asetek technology by OEMs and end users from the artic circle to the equator has been gratifying", stated John Hamill, Asetek Vice President of WW Sales and Marketing. "This is an opportunity for attendees to see our OEM's solutions as well as the latest Asetek technology including our new InRackCDU."
Asetek will be presenting at the ISC Exhibitor's Forum on June 22 at 10:40AM at booth #500. Asetek will discuss real world installations of liquid cooling and the latest cooling technology.
Asetek's range of solutions for HPC data centres includes RackCDU D2C (Direct-to-Chip), RackCDU ISAC (In-Server Air Conditioning), and ServerLSL (Server Level Sealed Loop). RackCDU D2C provides cooling energy savings greater than 50% and density increases of 2.5x-5x. RackCDU ISAC is a sealed server solution which captures over 90% of heat load into liquid and enables operation without concern for air quality. ServerLSL is liquid enhanced air cooling for server nodes that replaces less efficient air coolers and enables the servers to incorporate the highest performing CPUs and GPUs.