Supermicro highlights high efficiency, high performance supercomputing innovations in its TwinPro², FatTwin, SuperBlade and MicroBlade solutions at ISC'14

23 Jun 2014 Leipzig - Super Micro Computer Inc., a global expert in high-performance, high-efficiency server, storage technology and green computing exhibits its High Performance Computing solutions at the International Supercomputing Conference (ISC'14) in Leipzig, Germany. HPC solutions designed by Supermicro feature architecture innovations that optimize performance, I/O bandwidth and compute density while providing the most efficient air flow for minimum power consumption as well as ease of installation and maintenance.

With enhanced cooling and broadening support for Supermicro's new Titanium Level, high-efficiency (96%+) power supplies, these SuperServer solutions offer peak performance with the most green computing advantages available on the market. New innovative platforms highlighted at ISC'14 include the robust 2U TwinPro² featuring 4x dual-processor (DP) nodes and redundant Titanium Level high-efficiency (96%+) power supplies, the extreme density, ultra low power 6U 112-node Intel Atom based MicroBlade microserver (196 next-generation Xeon E5 DP per rack configuration coming), 1U NVMe/SAS3, 2U 6x GPU, 4U 8x GPU DP SuperServers, 4U Intel Xeon based 4x DP node 12x GPU FatTwin and 7U SuperBlade in 4-way, 2x and 3x GPU configurations.

Supermicro will also announcing support for Intel's next generation HPC fabric, Intel Omni Scale Fabric, and next-generation Intel® Xeon Phi processor, Knights Landing to simplify upgrade paths and accelerate access to the full parallel performance of Intel Xeon based processor and Intel Xeon Phi coprocessor technologies.

"Supermicro's latest advances in Green Computing from optimization for advanced technologies such as NVMe to cooling architecture innovations and Titanium Level power supplies increases the overall energy efficiency and performance of our most powerful HPC systems", stated Charles Liang, President and CEO of Supermicro. "As we increase the density, efficiency, performance and functionality across our hybrid computing platforms such as TwinPro, FatTwin, SuperBlade and MicroBlade, we provide the HPC community the widest range of truly green, scalable and sustainable building block solutions optimized to meet the most challenging supercomputing applications while also protecting our environment."

"Intel is re-architecting the future of High Performance Computing with the announcement of our end-to-end Intel Omni Scale Fabric and our plans to integrate the fabric onto future Intel Xeon and Intel Xeon Phi processors", stated Barry Davis General Manager of High Performance Fabric Organization Technical Computing Group, at Intel. "With partners such as Supermicro integrating our latest technologies across a wide range of high performance computing platforms, engineering and scientific fields will benefit from the faster data transfers, reduced latencies and higher efficiency that this new fabric provides."

Supermicro HPC systems feature the highest hybrid compute capacity in their class and are available in the industry's widest selection of green computing platforms supporting dual Intel Xeon processor E5-2600 v2 with NVIDIA Tesla GPUs or Intel Xeon Phi coprocessors. Notable supercomputing clusters featuring Supermicro green server solutions include the 2014 Green500 #1 ranked TSUBAME-KFC-GSIC supercomputer at Tokyo Institute of Technology.

With 1U SuperServers (SYS-1027GR-TQF) supporting 4x NVIDIA Tesla K20X GPU Accelerators submerged in Green Revolution Cooling CarnotJet liquid cooled tanks this cluster achieved a world record breaking performance/power efficiency of 4.5 GFLOPS per watt. In addition, the upcoming 2,000 node Vienna Scientific Cluster (VSC-3) featuring Supermicro's Data Center Optimized X9DRD-iF motherboards with dual Intel Xeon processor E5-2650 v2 submerged in GRC CarnotJet racks will maximize computational performance per watt for Austrian universities.
Source: Super Micro Computer