This new generation of Intel Xeon Phi coprocessors is designed and optimized to provide the best performance and offer the highest level of features, including 61 cores clocked at 1.23GHz, 16 GB of memory capacity support - double the amount available in accelerators or coprocessors today - and 1.2 TFlops of double precision performance.
Also RSC Tornado utilizes a new product added to the Intel Xeon Phi coprocessor 5100 family. Called the Intel Xeon Phi coprocessor 5120D, it is optimized for high density environments with the ability to allow sockets to attach directly to a mini-board for use in a blade form factor.
"Our innovative RSC Tornado liquid cooled architecture again delivered the high level of energy efficiency and world record computing (200+ TFlops per rack) and power (up to 100 kW per rack) density. This is a bright example of new technology level - 200 TFlops machine, that occupied a large hall just a few years ago, now fits into a one standard rack as well as you need only 5 computing racks based on RSC Tornado to get a supercomputer with 1 PFlops performance", stated Alexey Shmelev, Chief Operational Officer, RSC Group.
The use of an advanced liquid cooling system in RSC Tornado allows reaching industry's highest computing density of 200+ TFlops per 80*80cm*42U rack or 156 TFLOPS/m3 so de-facto setting the new world record for х86 architectures. Such a high computing density is required for ExaFLOPS-range supercomputers, which will consist of hundreds of racks each consuming over 100kW of power. The unique power and performance density levels achieved by RSC Tornado architecture proves technical feasibility of building high-performance systems with required characteristics for the exascale era.
The new stage in development of innovative RSC Tornado architecture for energy efficient data centres and supercomputing systems allowed RSC Group's specialists to implement world's first direct liquid cooling for widely available Intel Xeon based standard server boards - from various manufacturers, initially designed for traditional systems with air cooling of electronic components, with the latest Intel Xeon Phi coprocessors. This is the third generation of RSC's energy-efficient solutions for High Performance Computing, Cloud environments and data centres.
Powerful solutions with high computing density based on RSC Tornado architecture with direct liquid cooling are designed to solve various customers' needs. The product line includes RSC DCmicro (16 to 64 nodes), RSC DCmini (64 to 256 nodes) and RSC Data Center (from 2 high dense racks up to dozens of PFlops).
Among unique features of RSC Tornado architecture and solutions there are the following: