ASTRON & IBM Center for Exascale Technology to hand out first 3 MicroServers with novel packaging technology
16 Nov 2015 Dwingelo - On November 19, the first three MicroServers will be handed out by ASTRON & IBM Center for Exascale. This is a milestone for the DOME project. MicroServers are based on novel packaging technology developed at the IBM Research lab. The technology allows highly efficient water cooling of processor-, memory- and voltage-controller components. The microserver project, in a first stage, will aim at achieving the highest computer packaging density, including cooling, until today. Next 3-dimensional packaging (processor chips, and memory chips packaged together, with cooling) will be developed and used to achieve even higher densities of compute power.